集成电路的封装

C-Bend
Lead  Ceramic
Case PCMCIA Gull
Wing
Leads  SC-70 5L
PDIP SDIP PSDIP SOJ 32L PCDIP DIP
Dual
Inline Package SOP EIAJ TYPE II 14L DIP-tab
Dual Inline Package with Metal Heatsink FDIP SSOP 16L
    ZIP
Zig-Zag Inline Package CNR
Communication and Networking Riser Specification Revision 1.2

SIP
Single Inline Package

SIMM30
Single In-line Memory Module SOT220 SIMM72
Single In-line Memory Module FTO220 SIMM72
Single In-line Memory Module SLOT 1
For intel Pentium II Pentium III & Celeron CPU SLOT A
For AMD Athlon CPU PCI 32bit 5V
Peripheral Component Interconnect PCI 64bit 3.3V
Peripheral Component Interconnect ITO3p ITO220

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本文关键字：集成电路  器件命名及常用参数，元器件介绍 - 器件命名及常用参数