集成电路标准封装(a-f开关头)

外形图 封装说明   AC'97
v2.2 specifICation
  AGP 3.3V
ACCelerated Graphics Port
Specification 2.0
  AGP PRO
Accelerated Graphics Port PRO
Specification 1.01
  AGP
Accelerated Graphics Port
Specification 2.0
  AMR
Audio/Modem Riser
  BGA
Ball Grid Array
  BQFP132
  EBGA 680L   LBGA 160L   PBGA 217L
Plastic Ball Grid Array
  SBGA 192L   TSBGA 680L   C-Bend Lead   Cerquad
Ceramic Quad Flat PACk
  CLCC   CNR
Communication and Networking Riser Specification Revision 1.2
  CPGA
Ceramic PIN Grid Array   Ceramic Case
  LAMINATE CSP 112L
Chip Scale Package
  DIP
Dual Inline Package
  DIP-tab
Dual Inline Package with Metal Heatsink   DIMM 168   DIMM DDR   DIMM168
Dual In-line Memory Module
  DIMM184
For DDR SDRAM Dual In-line Memory Module
  EISA
Extended ISA
  FBGA   FDIP

本文关键字：开关  集成电路  器件命名及常用参数，元器件介绍 - 器件命名及常用参数