对于比较便宜的东西，我敢于随意的拆卸，但是当价值上升到三位数时，我还是很谨慎。当价值更高时，我知道我需要寻求伙伴。这也是我与Portelligent合作的原因。本文内容主要来源于与Portelligent的讨论以及他们的发现。除此之外还有我从iSuppli和SEMIconductor Insights得出的分析，最后包括一些匿名知情人士的消息。
从 iPhone 的精细程度来看，我认为它主要是在中国或者其它有低成本熟练工的地方由手工完成。相对于Compaq的iPaq 3835，iPhone多了Wi-Fi、蓝牙以及GSM电话和数据支持, 拥有位置传感器，更强的CPU和更大的内存，但它的外形规格比iPaq 3835小了几乎1/3。Apple的电子和机械工程师团队以及各家半导体供应商通力合作的成果真是让人吃惊。
iPhone采用来自MICron的200万像素的CMOS传感器，无闪光灯，只可以拍摄静态图像；3.7v的锂电池占据了iPhone很大的地方，据Apple估计充电400次后电池还会有最初容量的80%；它的天线集中在一块独立的柔性电路板上，包括2.4G蓝牙/Wi-Fi集成式 天线和多频带(850-, 900-, 1800- 以及1900-MHz)蜂窝电话天线；3.5寸的TFT LCD包含有NS半导体的接收器，达到480×320像素160dpi的分辨率，Broadcom的触摸屏控制器和NXP的 ARM 7TDMI共同构成一个协系统，实现多点同时触摸。
有EMI防护的主板由数字和RF两块PCB组成。数字PCB的左边是一块NAND闪存，有理由相信是Apple最早使用的来自三星公司的采用MLC技术的NAND闪存；右侧是一块Apple标记的应用处理器和一块易失性存储器，通过分析知道处理器芯片由三星制造，虽然有可能无法从公开市场得到这颗芯片，但是黑客通过分析iPhone的固件已经得到了一些信息：比如它基于ARM1176JZF，频率在600MHz以上，八阶流水线，功耗为0.45mW/MHZ。固件分析还指出三星的CPU包含一个图形核。关于非易失性存储器Semiconductor Insight认为是SRAM，而Portelligent认为是移动DDR SDRAM。通过封装标记和管芯标识以及数据手册，Portelligent坚信他们是正确的。我没有亲眼看到管芯，所以没法确定内部到底采用了什么存储技术，但是DRAM比起SRAM在每比特成本上的优势不能视而不见，而Apple被报道的大于50%的毛利润不可能不去控制BOM的成本。
NAND闪存的右上角是ST公司基于MEMS技术的加速度IC，它用来确定iPhone当前的方向（纵向对横向）以调整屏幕显示。目前这个功能仅仅在网页浏览、照片观赏以及iPod音频和视频回放时有效。而且，手持iPhone时至少要与地面呈45°角（理想为垂直于地面）加速度芯片才可以可靠检测到水平与垂直的方位。根据我的匿名线人消息，这确实如我之前的一个预测是由于硬件的限制所致。无论如何，这应该是iPhone和芯片厂商在第二代iPhone中要解决的问题。
在数字PCB板上还有其他一些主要的芯片，包括ARM CPU上方的来自Wolfson公司的音频编解码器，ARM CPU下方的来自Linear公司和NXP公司的电源管理芯片，CPU和NAND闪存之间的来自国半公司的移动像素链接（MPL）发送器，以及MPL和加速度芯片间的来自TI公司的LCD升压变压器。数字PCB的另一面主要是SIM卡连接器和一个来自SST公司的1Mbyte并行接口的闪存，它有可能是ARM CPU的启动芯片。
iPhone的射频板上同样布满了芯片，PCB右侧是来自Infineon的GSM/EDGE射频发送器，右下角是Skyworks的功率放大器，Epcos的发送/接受双工器，PCB左侧是来自Marvell的802.11b/g Wi-Fi发送器，来自Cambrige公司的蓝牙发送器，Infineon公司的蜂窝基带处理器以及一个Intel标识的单封装双管芯的存储组件。这颗存储芯片包含有32Mbit的NOR闪存和一个易失性的储存体，Semiconductor Insights和Portelligent对易失性存储体又产生了是SRAM还是PSRAM的分歧。
iPhone还有一些连接件不含元器件，图片可在网站查阅。
对于iPhone，除了它的雅致和高度集成性让我迷恋外，还有三个方面让我很感兴趣：
* NAND和NOR的选取：这个话题争论很久了， iPhone 至少表明了Apple的立场，那就是两者都有。NAND闪存中存储了Mac操作系统的大部分系统代码，以及音乐、视频和其他一些非易失性的数据，系统启动代码存储于NOR闪存中。实际上iPhone中有两块独立的NOR闪存，分别位于数字和射频板上，分别对应 ARM 应用处理器和Infineon基带处理器。
* 说到ARM处理器，它在iPhone中的地位很令人吃惊。我们来算算它的数量：单独有两颗，802.11收发器可能会包含，Infineon基带处理器可能会包含，蓝牙收发器中也可能会有。
* 谈到一个系统里的多颗处理器，iPhone在这点上和PC很不同。iPhone中的多个CPU核分担总的任务，起到不同的作用，在没有任务时系统可以有选择的降频或者掉电来节约功耗。这种系统结构与Intel之前基于ARM的XScale很不同，iPhone本质上是软件驱动的设计。
最后我以一个 参考链接结束 ，它回答了一个很关键的问题。对于那些生活历来很节俭的人来讲，你们最好不要点击这个链接。
附英文原文：
I admit it: I'm a bit of a wimp when it comes to Prying Eyes teardowns. Get me a piece of gear with an eaSILy (or at least somewhat ea sily) removable top, side (or top, depending on how you orient it) or back panel, and I'll gleefully grab a screwdriver regardless of the widget's cost. Well…within reason, that is, and especially if it's no longer working, anyway. If it's free or free-after-rebate, I'm not worried about breaking it during dissection. An already partially dISAssembLED patient is a bonus, as is cereal on the side. Even a double-digit prICetag isn't too much of a barrier, either to my nerves or to the aCCountants who approve my expense reports.
But when a Prying Eyes CANdidate's cost crosses the triple-digit threshold, I take serious pause before pursuing the project. And when the cash register rings up a McKinley (or more), I know where to go—in pursuit of a partnership with someone else who's already tackled the teardown!
That's why I LOCked arms with Llamma.com for my recent analysis of MicroSOFt's Xbox 360 Elite. And that's why I joined up with Portelligent for this Prying Eyes project. Portelligent published a bill-of-materials inventory and a cost-estimate report soon after Apple and AT&T began selling the iPhone on the evening of June 29. I'm profoundly grateful to Portelligent for agreeing to join with me on this Prying Eyes adventure. By leveraging their existing work, I'll be able to preserve my iPhone's functionality for future hands-on reports, as Apple and AT&T evolve the device's feature set.
The information that follows comes predominantly from my discussions with Portelligent, along with published reports of their findings. I've supplemented it with my analysis of similar (and oft-contraDICtory) reports from iSuppli and SEMIconductor Insights, coupLED with additional close-up internal images published by AnandTech, Ars TechnICa, the FCC, iFixit, PDAParts, and Think Secret. And finally, I've added to the blend some information that I obtained from anonymous in-the-know confidants. Apple's an extremely paranoid company, both with respect to its employees and its suppliers, so I'm not able to reveal my sources' identities or even their employers.
If you peruse AnandTech, iFixit, or Think Secret's pictorial step-by-step dISAssemblies, or PDAParts' or Semiconductor Insights' abbreviated YouTube clips, you'll hopefully get a sense of just how precisely designed the iPhone is. For that reason, I doubt there's a large degree of automated assembly involved; the iPhone is likely constructed largely by hand in China (where iPods are built today) or some other LOCation with low-cost, highly skilled labor. Compare the iPhone imagery to that of the Compaq iPaq 3835, which was the subject of my Nov. 23, 2006 Prying Eyes piece. Now consider that the iPhone integrates Wi-Fi, Bluetooth, and GSM cellular data and voice, along with a position sensor, none of which the iPaq provides, along with a much more powerful CPU and substantially more nonvolatile and volatile memory. Finally, realize that the iPhone's form factor is almost 3× smaller in total volume than that of the iPaq 3835 (in fairness, I should point out that the iPaq 3835's screen is 0.25-in. wider than that of the iPhone, although the two LCD's lengths are identical). After digesting this data, you'll likely walk away quite impressed, as I was, with the accomplishments of Apple's eleCTRical and mechanical engineering teams, as well as with the integration accomplishments of Apple's various semiconductor suppliers.
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